Inventor
CARVER COLIN
US4 patents
Patents
4 patentsUS11289421B2Mar 29, 2022
Methods and structures for improved electrical contact between bonded integrated circuit interfaces
INTEL CORP2 citations69
US11887887B2Jan 30, 2024
Interconnect structures and methods of fabrication
INTEL CORP0 citations59
US11784123B2Oct 10, 2023
Methods and structures for improved electrical contact between bonded integrated circuit interfaces
INTEL CORP0 citations59
US11404307B2Aug 2, 2022
Interconnect structures and methods of fabrication
INTEL CORP0 citations59