Inventor · disambiguated record
Byung Jun Bang
Also filed as: BANG BYUNG JUN
5 granted patents·2 citations·filing 2013–2023
63Inventor score
Technology areasH10W
Files withSK HYNIX INC5
Top patents by PatentIndex Score
5 records- 0190US11605615B2Semiconductor package and semiconductor module including the sameSK HYNIX INC·Filed 2021·Granted Mar 14, 2023·2 cites·20 claims
- 0267US12015015B2Semiconductor package and semiconductor module including the sameSK HYNIX INC·Filed 2023·Granted Jun 18, 2024·0 cites·18 claims
- 0352US12199061B2Semiconductor packagesSK HYNIX INC·Filed 2022·Granted Jan 14, 2025·0 cites·19 claims
- 0444US9231286B2Package substrate with band stop filter and semiconductor package including the sameSK HYNIX INC·Filed 2013·Granted Jan 5, 2016·0 cites·20 claims
- 0537US11362043B2Memory package including a memory chip and a memory controllerSK HYNIX INC·Filed 2020·Granted Jun 14, 2022·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →