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Inventor
HEIER JACOB
CH
2 patents
⚠️ This page may combine multiple inventors who share the name “HEIER JACOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EMPA EIDGENOESSISCHE MAT & FORSCHUNGSANSTALT
1 patent
US12069936B2
Aug 20, 2024
Electronic device and method for slot-die depositing layers of the same
EMPA EIDGENOESSISCHE MAT & FORSCHUNGSANSTALT
0 citations
50
EMPA Eidgenossische Materialprufungs—und Forschungsanstalt
1 patent
US12033812B2
Jul 9, 2024
Electronic device and method for producing layers of the same
EMPA Eidgenossische Materialprufungs—und Forschungsanstalt
0 citations
37