Inventor
TSAI WEI-TAO
TW3 patents
Patents
3 patentsUS12230554B2Feb 18, 2025
Shield structure for backside through substrate vias (TSVs)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11764129B2Sep 19, 2023
Method of forming shield structure for backside through substrate vias (TSVS)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11062977B2Jul 13, 2021
Shield structure for backside through substrate vias (TSVs)
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61