P

Inventor

BOVIO EZIO

IT9 patents
⚠️ This page may combine multiple inventors who share the name “BOVIO EZIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALWAFERS CO LTD

4 patents
US11707813B2Jul 25, 2023

Semiconductor wafer thermal removal control

GLOBALWAFERS CO LTD2 citations70
US10960513B2Mar 30, 2021

Methods and systems for polishing pad control

GLOBALWAFERS CO LTD2 citations70
US10946493B2Mar 16, 2021

Methods and systems for polishing pad control

GLOBALWAFERS CO LTD2 citations70
US12350784B2Jul 8, 2025

Semiconductor wafer thermal removal control

GLOBALWAFERS CO LTD0 citations60

MEMC ELECTRONIC MATERIALS SPA

2 patents
US7137874B1Nov 21, 2006

Semiconductor wafer, polishing apparatus and method

MEMC ELECTRONIC MATERIALS SPA25 citations88
US6878302B1Apr 12, 2005

Method of polishing wafers

MEMC ELECTRONIC MATERIALS SPA15 citations79

MEMC ELECTRONIC MATERIALS

2 patents
US7846007B2Dec 7, 2010

System and method for dressing a wafer polishing pad

MEMC ELECTRONIC MATERIALS3 citations57
US7846006B2Dec 7, 2010

Dressing a wafer polishing pad

MEMC ELECTRONIC MATERIALS3 citations57

SUNEDISON SEMICONDUCTOR LTD UEN201334164H

1 patent
US10654145B2May 19, 2020

Methods and systems for polishing pad control

SUNEDISON SEMICONDUCTOR LTD UEN201334164H2 citations70