Inventor

BECKENBAUGH WILLIAM M

12 patents

⚠️ This page may combine multiple inventors who share the name “BECKENBAUGH WILLIAM M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

6 patents

US5229070AJul 20, 1993

Low temperature-wetting tin-base solder paste

MOTOROLA INC79 citations95

US5593903AJan 14, 1997

Method of forming contact pads for wafer level testing and burn-in of semiconductor dice

MOTOROLA INC128 citations94

US5194137AMar 16, 1993

Solder plate reflow method for forming solder-bumped terminals

MOTOROLA INC69 citations94

US5160409ANov 3, 1992

Solder plate reflow method for forming a solder bump on a circuit trace intersection

MOTOROLA INC70 citations94

US5377027ADec 27, 1994

Liquid crystal display device with pixel registration illumination

MOTOROLA INC23 citations92

US5848466ADec 15, 1998

Method for forming a microelectronic assembly

MOTOROLA INC34 citations89

WESTERN ELECTRIC CO

6 patents

US4261800AApr 14, 1981

BECKENBAUGH WILLIAM M

MOTOROLA INC

Low temperature-wetting tin-base solder paste

Method of forming contact pads for wafer level testing and burn-in of semiconductor dice

Solder plate reflow method for forming solder-bumped terminals

Solder plate reflow method for forming a solder bump on a circuit trace intersection

Liquid crystal display device with pixel registration illumination

Method for forming a microelectronic assembly

WESTERN ELECTRIC CO

Method of selectively depositing a metal on a surface of a substrate

Method of depositing a stress-free electroless copper deposit

Method of depositing a metal on a surface

Method for depositing a metal on a surface

Method of depositing a stress-free electroless copper deposit

Methods of depositing metallic copper on substrates