Inventor
CHILLARA SATYA
US9 patents
Patents
9 patentsUS5739581AApr 14, 1998
High density integrated circuit package assembly with a heatsink between stacked dies
NAT SEMICONDUCTOR CORP226 citations98
US5650659AJul 22, 1997
Semiconductor component package assembly including an integral RF/EMI shield
NAT SEMICONDUCTOR CORP205 citations97
US5648679AJul 15, 1997
Tape ball lead integrated circuit package
NAT SEMICONDUCTOR CORP116 citations97
US5627405AMay 6, 1997
Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer
NAT SEMICONDUCTOR CORP130 citations97
US5705851AJan 6, 1998
Thermal ball lead integrated package
NAT SEMICONDUCTOR CORP92 citations95
US6184575B1Feb 6, 2001
Ultra-thin composite package for integrated circuits
NAT SEMICONDUCTOR CORP41 citations92
US5569955AOct 29, 1996
High density integrated circuit assembly combining leadframe leads with conductive traces
NAT SEMICONDUCTOR CORP26 citations92
US5498901AMar 12, 1996
Lead frame having layered conductive planes
NAT SEMICONDUCTOR CORP43 citations92
US5442230AAug 15, 1995
High density integrated circuit assembly combining leadframe leads with conductive traces
NAT SEMICONDUCTOR CORP25 citations92