Inventor
LU HORNG-BOR
TW27 patents
Patents
27 patentsUS6013581AJan 11, 2000
Method for preventing poisoned vias and trenches
UNITED MICROELECTRONICS CORP76 citations96
US5876508AMar 2, 1999
Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process
UNITED MICROELECTRONICS CORP73 citations94
US6225204B1May 1, 2001
Method for preventing poisoned vias and trenches
UNITED MICROELECTRONICS CORP21 citations92
US6071806AJun 6, 2000
Method for preventing poisoned vias and trenches
UNITED MICROELECTRONICS CORP46 citations92
US5883014AMar 16, 1999
Method for treating via sidewalls with hydrogen plasma
UNITED MICROELECTRONICS CORP61 citations92
US6008108ADec 28, 1999
Method of fabricating a shallow-trench isolation structure in an integrated circuit
UNITED MICROELECTRONICS CORP21 citations86
US6180467B1Jan 30, 2001
Method of fabricating shallow trench isolation
UNITED MICROELECTRONICS CORP17 citations84
US6057248AMay 2, 2000
Method of removing residual contaminants in an alignment mark after a CMP process
UNITED MICROELECTRONICS CORP16 citations84
US6150259ANov 21, 2000
Method for forming a metal plug
UNITED MICROELECTRONICS CORP12 citations74
US6013559AJan 11, 2000
Method of forming trench isolation
UNITED MICROELECTRONICS CORP8 citations74
US6146742ANov 14, 2000
Barrier/glue layer on polysilicon layer
UNITED MICROELECTRONICS CORP12 citations73
US6030892AFeb 29, 2000
Method of preventing overpolishing in a chemical-mechanical polishing operation
UNITED MICROELECTRONICS CORP8 citations73
US5990004ANov 23, 1999
Method for forming a tungsten plug and a barrier layer in a contact of high aspect ratio
UNITED MICROELECTRONICS CORP10 citations73
US6123776ASep 26, 2000
Gas delivering apparatus for chemical vapor deposition
UNITED MICROELECTRONICS CORP6 citations71
US6093634AJul 25, 2000
Method of forming a dielectric layer on a semiconductor wafer
UNITED MICROELECTRONICS CORP10 citations71
US6093639AJul 25, 2000
Process for making contact plug
UNITED MICROELECTRONICS CORP7 citations71
US5950108ASep 7, 1999
Method of fabricating a conductive plug
UNITED MICROELECTRONICS CORP15 citations71
US5883004AMar 16, 1999
Method of planarization using interlayer dielectric
UNITED MICROELECTRONICS CORP8 citations69
US6333261B1Dec 25, 2001
Method for preventing aluminum intrusions
UNITED MICROELECTRONICS CORP13 citations68
US9378968B2Jun 28, 2016
Method for planarizing semiconductor device
UNITED MICROELECTRONICS CORP2 citations61
US6121132ASep 19, 2000
Method for reducing stress on collimator titanium nitride layer
UNITED MICROELECTRONICS CORP2 citations61
US6426546B1Jul 30, 2002
Reducing relative stress between HDP layer and passivation layer
UNITED MICROELECTRONICS CORP3 citations60
US6136164AOct 24, 2000
Apparatus for detecting position of collimator in sputtering processing chamber
UNITED MICROELECTRONICS CORP4 citations60
US6365062B1Apr 2, 2002
Treatment on silicon oxynitride
UNITED MICROELECTRONICS CORP0 citations43
US6235647B1May 22, 2001
Deposition process for forming void-free dielectric layer
UNITED MICROELECTRONICS CORP0 citations43
US6060405AMay 9, 2000
Method of deposition on wafer
UNITED MICROELECTRONICS CORP1 citations42
US6657283B2Dec 2, 2003
Reducing relative stress between HDP layer and passivation layer
UNITED MICROELECTRONICS CORP0 citations39