Inventor

PROGL CURT L

US2 patents

⚠️ This page may combine multiple inventors who share the name “PROGL CURT L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COMPAQ COMPUTER CORP

1 patent

US6366460B1Apr 2, 2002

Heat dissipation structure for electronic apparatus component

COMPAQ COMPUTER CORP47 citations94

HEWLETT PACKARD DEVELOPMENT CO

1 patent

US6570761B2May 27, 2003

Heat dissipation structure for electronic apparatus component

HEWLETT PACKARD DEVELOPMENT CO19 citations90