Inventor

ANDOH YOUICHI

JP3 patents

Patents

3 patents

US7164097B2Jan 16, 2007

Solder ball bonding method and bonding device

TDK CORP10 citations82

US7357295B2Apr 15, 2008

Solder ball supplying method and supplying device

TDK CORP6 citations61

US7267839B2Sep 11, 2007

Method of and apparatus for applying liquid material

TDK CORP0 citations47