Inventor
ISHIKAWA KENSUKE
JP26 patents
⚠️ This page may combine multiple inventors who share the name “ISHIKAWA KENSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
10 patentsUS9659867B2May 23, 2017
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP2 citations84
US9064870B2Jun 23, 2015
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP7 citations84
US8617981B2Dec 31, 2013
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP4 citations74
US8053893B2Nov 8, 2011
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP6 citations73
US8810034B2Aug 19, 2014
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP1 citations63
US7777346B2Aug 17, 2010
Semiconductor integrated circuit device and a method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations62
US10304726B2May 28, 2019
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations52
US10121693B2Nov 6, 2018
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations52
US9818639B2Nov 14, 2017
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations52
US9490213B2Nov 8, 2016
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations52
RENESAS TECH CORP
7 patentsUS7323781B2Jan 29, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP30 citations95
US6838772B2Jan 4, 2005
Semiconductor device
RENESAS TECH CORP47 citations92
US7459786B2Dec 2, 2008
Semiconductor device
RENESAS TECH CORP9 citations84
US7777343B2Aug 17, 2010
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP2 citations63
US7018919B2Mar 28, 2006
Method of manufacturing a semiconductor integrated circuit device including a hole formed in an insulating film and a first conductive film formed over a bottom region and sidewalls of the hole
RENESAS TECH CORP2 citations62
US7569476B2Aug 4, 2009
Semiconductor integrated circuit device and a method of manufacturing the same
RENESAS TECH CORP0 citations51
US7095120B2Aug 22, 2006
Semiconductor integrated circuit device with a connective portion for multilevel interconnection
RENESAS TECH CORP0 citations51
SANDISK TECHNOLOGIES LLC
6 patentsUS10115735B2Oct 30, 2018
Semiconductor device containing multilayer titanium nitride diffusion barrier and method of making thereof
SANDISK TECHNOLOGIES LLC24 citations94
US11935784B2Mar 19, 2024
Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the same
SANDISK TECHNOLOGIES LLC4 citations73
US12456699B2Oct 28, 2025
Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same
SANDISK TECHNOLOGIES LLC0 citations62
US12451451B2Oct 21, 2025
Bonded assembly including interconnect-level bonding pads and methods of forming the same
SANDISK TECHNOLOGIES LLC0 citations62
US12550787B2Feb 10, 2026
Bonded assembly containing bonding pads with metal oxide barriers and methods for forming the same
SANDISK TECHNOLOGIES LLC1 citations61
US12087626B2Sep 10, 2024
High aspect ratio via fill process employing selective metal deposition and structures formed by the same
SANDISK TECHNOLOGIES LLC0 citations52