P

Inventor

FINDEIS PAUL F

US10 patents
⚠️ This page may combine multiple inventors who share the name “FINDEIS PAUL F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

6 patents
US6099935AAug 8, 2000

Apparatus for providing solder interconnections to semiconductor and electronic packaging devices

IBM24 citations91
US5869139AFeb 9, 1999

Apparatus and method for plating pin grid array packaging modules

IBM40 citations88
US6203690B1Mar 20, 2001

Process of reworking pin grid array chip carriers

IBM12 citations73
US6149048ANov 21, 2000

Apparatus and method for use in manufacturing semiconductor devices

IBM7 citations72
US6051119AApr 18, 2000

Plating structure for a pin grid array package

IBM6 citations67
US6448169B1Sep 10, 2002

Apparatus and method for use in manufacturing semiconductor devices

IBM5 citations61

VOLANT RICHARD P

2 patents
US8394715B2Mar 12, 2013

Method of fabricating coaxial through-silicon via

VOLANT RICHARD P16 citations92
US8242604B2Aug 14, 2012

Coaxial through-silicon via

VOLANT RICHARD P33 citations92

ARNDT RUSSELL HERBERT

2 patents
US8298435B2Oct 30, 2012

Selective etching bath methods

ARNDT RUSSELL HERBERT6 citations78
US9177822B2Nov 3, 2015

Selective etching bath methods

ARNDT RUSSELL HERBERT3 citations57