Inventor
SHIN DONG-KIL
KR11 patents
⚠️ This page may combine multiple inventors who share the name “SHIN DONG-KIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS6756668B2Jun 29, 2004
Semiconductor package having thermal interface material (TIM)
SAMSUNG ELECTRONICS CO LTD19 citations91
US6638638B2Oct 28, 2003
Hollow solder structure having improved reliability and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD11 citations72
US7081375B2Jul 25, 2006
Semiconductor package having thermal interface material (TIM)
SAMSUNG ELECTRONICS CO LTD4 citations61
US6963033B2Nov 8, 2005
Ball grid array attaching means having improved reliability and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD4 citations61
SHIN DONG-KIL
2 patentsSK HYNIX INC
2 patentsUS10393646B2Aug 27, 2019
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
SK HYNIX INC0 citations47
US9945772B2Apr 17, 2018
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
SK HYNIX INC0 citations47