P

Inventor

OGAWA TATSUO

JP44 patents
⚠️ This page may combine multiple inventors who share the name “OGAWA TATSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

17 patents
US5652042AJul 29, 1997

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD111 citations98
US5484647AJan 16, 1996

Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD212 citations97
US6518514B2Feb 11, 2003

Circuit board and production of the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD48 citations96
US6139777AOct 31, 2000

Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD87 citations96
US6096411AAug 1, 2000

Conductive paste composition for via hole filling and printed circuit board using the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD73 citations96
US5972482AOct 26, 1999

Printed circuit board and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD57 citations96
US5977490ANov 2, 1999

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD66 citations95
US5914358AJun 22, 1999

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD49 citations95
US6774316B1Aug 10, 2004

Wiring board and production method thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD50 citations92
US6691409B2Feb 17, 2004

Method of producing a circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations92
US6326694B1Dec 4, 2001

Printed circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations92
US6108903AAug 29, 2000

Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD42 citations92
US5733467AMar 31, 1998

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD33 citations92
US5159524AOct 27, 1992

Laser trimable capacitor

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD28 citations91
US6211487B1Apr 3, 2001

Printed circuit board and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD11 citations73
US6713688B2Mar 30, 2004

Circuit board and its manufacture method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations72
US7047629B2May 23, 2006

Method of manufacturing circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations61

NGK SPARK PLUG CO

9 patents

YAZAKI CORP

5 patents

PANASONIC CORP

3 patents

HIRANO KOICHI

2 patents

OGAWA TATSUO

2 patents

TOYOTA JIDOSHOKKI KK

1 patent

TOYODA AUTOMATIC LOOM WORKS

1 patent

NEC CORP

1 patent

SONY CORP

1 patent

SUZUKI TAKESHI

1 patent

NAKATANI SEIICHI

1 patent