Inventor

MICHAELI BENNY

IL3 patents

Patents

3 patents

US7669320B2Mar 2, 2010

Coreless cavity substrates for chip packaging and their fabrication

AMITEC ADVANCED MULTILAYER INT70 citations94

US7682972B2Mar 23, 2010

Advanced multilayer coreless support structures and method for their fabrication

AMITEC ADVANCED MULTILAYER INT35 citations89

US7635641B2Dec 22, 2009

Integrated circuit support structures and their fabrication

AMITEC ADVANCED MULTILAYER INT41 citations87