Inventor

DUNAWAY THOMAS J

US24 patents

⚠️ This page may combine multiple inventors who share the name “DUNAWAY THOMAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DUNAWAY THOMAS J

HONEYWELL INC

Universal semiconductor chip package

Method of manufacturing a leadframe having conductive elements preformed with solder bumps

Test and tear-away bond pad design

Semiconductor package with weldable ceramic lid

Package to semiconductor chip active interconnect site method

Method of making a surface etched shadow mask

Universal semiconductor chip package

Package to board variable pitch tab

Low-cost high-performance semiconductor chip package

Method of die bonding semiconductor chip by using removable non-wettable by solder frame

Method of manufacturing a high-yield solder bumped semiconductor wafer

Stacked tab leadframe assembly

Vacuum die bond for known good die assembly

Direct microcircuit decoupling

Controlled compression furnace bonding

IC package lid for dose enhancement protection

Semiconductor package with a bridge for chip area connection

Removable drop-through die bond frame

Method of die bonding semiconductor chip by using removable frame

Solder bonding material

Optoelectronic lens array with an integrated circuit

Surface etched shadow mask

Method for providing a test connection and a permanent connection site on an unpackaged semiconductor die

ATMEL CORP

Fluxing agent