Inventor
SPIELBERGER RICHARD K
US37 patents
⚠️ This page may combine multiple inventors who share the name “SPIELBERGER RICHARD K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HONEYWELL INC
26 patentsUS6169254B1Jan 2, 2001
Three axis sensor package on flexible substrate
HONEYWELL INC61 citations96
US6005778ADec 21, 1999
Chip stacking and capacitor mounting arrangement including spacers
HONEYWELL INC294 citations96
US5939772AAug 17, 1999
Shielded package for magnetic devices
HONEYWELL INC61 citations96
US5066831ANov 19, 1991
Universal semiconductor chip package
HONEYWELL INC55 citations96
US5998867ADec 7, 1999
Radiation enhanced chip encapsulant
HONEYWELL INC116 citations95
US5066614ANov 19, 1991
Method of manufacturing a leadframe having conductive elements preformed with solder bumps
HONEYWELL INC102 citations95
US5644230AJul 1, 1997
Miniature magnetometer and flexible circuit
HONEYWELL INC61 citations94
US5891745AApr 6, 1999
Test and tear-away bond pad design
HONEYWELL INC44 citations92
US5498900AMar 12, 1996
Semiconductor package with weldable ceramic lid
HONEYWELL INC36 citations92
US5161729ANov 10, 1992
Package to semiconductor chip active interconnect site method
HONEYWELL INC23 citations92
US5139610AAug 18, 1992
Method of making a surface etched shadow mask
HONEYWELL INC26 citations92
US5036163AJul 30, 1991
Universal semiconductor chip package
HONEYWELL INC34 citations92
US4999700AMar 12, 1991
Package to board variable pitch tab
HONEYWELL INC22 citations92
US4979289ADec 25, 1990
Method of die bonding semiconductor chip by using removable non-wettable by solder frame
HONEYWELL INC23 citations92
US4980753ADec 25, 1990
Low-cost high-performance semiconductor chip package
HONEYWELL INC25 citations92
US4898320AFeb 6, 1990
Method of manufacturing a high-yield solder bumped semiconductor wafer
HONEYWELL INC35 citations92
US5099306AMar 24, 1992
Stacked tab leadframe assembly
HONEYWELL INC47 citations91
US6611054B1Aug 26, 2003
IC package lid for dose enhancement protection
HONEYWELL INC18 citations84
US5719748AFeb 17, 1998
Semiconductor package with a bridge for chip area connection
HONEYWELL INC17 citations82
US5061822AOct 29, 1991
Radial solution to chip carrier pitch deviation
HONEYWELL INC6 citations74
US5043533AAug 27, 1991
Chip package capacitor cover
HONEYWELL INC15 citations74
US5101550AApr 7, 1992
Removable drop-through die bond frame
HONEYWELL INC7 citations73
US5074036ADec 24, 1991
Method of die bonding semiconductor chip by using removable frame
HONEYWELL INC15 citations73
US5010387AApr 23, 1991
Solder bonding material
HONEYWELL INC15 citations73
US4528446AJul 9, 1985
Optoelectronic lens array with an integrated circuit
HONEYWELL INC15 citations72
US4980240ADec 25, 1990
Surface etched shadow mask
HONEYWELL INC5 citations63
HONEYWELL INT INC
5 patentsUS6657134B2Dec 2, 2003
Stacked ball grid array
HONEYWELL INT INC55 citations89
US6027948AFeb 22, 2000
Method to permit high temperature assembly processes for magnetically sensitive devices
HONEYWELL INT INC24 citations89
US7736946B2Jun 15, 2010
System and method for sealing a MEMS device
HONEYWELL INT INC16 citations82
US7635916B2Dec 22, 2009
Integrated circuit package with top-side conduction cooling
HONEYWELL INT INC5 citations62
US7863720B2Jan 4, 2011
Method and system for stacking integrated circuits
HONEYWELL INT INC0 citations52
MICRON TECHNOLOGY INC
4 patentsUS6916668B2Jul 12, 2005
Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cells
MICRON TECHNOLOGY INC36 citations96
US7078243B2Jul 18, 2006
Shielding arrangement to protect a circuit from stray magnetic fields
MICRON TECHNOLOGY INC12 citations93
US6515352B1Feb 4, 2003
Shielding arrangement to protect a circuit from stray magnetic fields
MICRON TECHNOLOGY INC27 citations93
US7569915B2Aug 4, 2009
Shielding arrangement to protect a circuit from stray magnetic fields
MICRON TECHNOLOGY INC9 citations84