Inventor
DICKS LORI A
US11 patents
⚠️ This page may combine multiple inventors who share the name “DICKS LORI A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HONEYWELL INC
10 patentsUS5066614ANov 19, 1991
Method of manufacturing a leadframe having conductive elements preformed with solder bumps
HONEYWELL INC102 citations95
US5161729ANov 10, 1992
Package to semiconductor chip active interconnect site method
HONEYWELL INC23 citations92
US4979289ADec 25, 1990
Method of die bonding semiconductor chip by using removable non-wettable by solder frame
HONEYWELL INC23 citations92
US4980753ADec 25, 1990
Low-cost high-performance semiconductor chip package
HONEYWELL INC25 citations92
US4898320AFeb 6, 1990
Method of manufacturing a high-yield solder bumped semiconductor wafer
HONEYWELL INC35 citations92
US5099306AMar 24, 1992
Stacked tab leadframe assembly
HONEYWELL INC47 citations91
US4892245AJan 9, 1990
Controlled compression furnace bonding
HONEYWELL INC50 citations88
US5101550AApr 7, 1992
Removable drop-through die bond frame
HONEYWELL INC7 citations73
US5074036ADec 24, 1991
Method of die bonding semiconductor chip by using removable frame
HONEYWELL INC15 citations73
US5010387AApr 23, 1991
Solder bonding material
HONEYWELL INC15 citations73