Inventor
CHEN KUO-MING
CN20 patents
⚠️ This page may combine multiple inventors who share the name “CHEN KUO-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
9 patentsUS6940176B2Sep 6, 2005
Solder pads for improving reliability of a package
UNITED MICROELECTRONICS CORP30 citations92
US6881654B2Apr 19, 2005
Solder bump structure and laser repair process for memory device
UNITED MICROELECTRONICS CORP22 citations90
US7026234B2Apr 11, 2006
Parasitic capacitance-preventing dummy solder bump structure and method of making the same
UNITED MICROELECTRONICS CORP14 citations83
US7241678B2Jul 10, 2007
Integrated die bumping process
UNITED MICROELECTRONICS CORP3 citations62
US7211500B2May 1, 2007
Pre-process before cutting a wafer and method of cutting a wafer
UNITED MICROELECTRONICS CORP6 citations62
US7534653B2May 19, 2009
Chip packaging process
UNITED MICROELECTRONICS CORP4 citations61
US7268440B2Sep 11, 2007
Fabrication of semiconductor integrated circuit chips
UNITED MICROELECTRONICS CORP2 citations60
US9269645B1Feb 23, 2016
Fan-out wafer level package
UNITED MICROELECTRONICS CORP0 citations52
US7399695B2Jul 15, 2008
Integrated die bumping process
UNITED MICROELECTRONICS CORP1 citations51
JWU CHING HK CO LTD
5 patentsUSD641933SJul 19, 2011
Cosmetic case
JWU CHING HK CO LTD17 citations91
USD631606SJan 25, 2011
Cosmetic case
JWU CHING HK CO LTD40 citations91
USD630380SJan 4, 2011
Cosmetic case
JWU CHING HK CO LTD7 citations83
USD631202SJan 18, 2011
Cosmetic case
JWU CHING HK CO LTD2 citations61
USD630379SJan 4, 2011
Cosmetic case
JWU CHING HK CO LTD3 citations61