Inventor
NAKATA YOSHIROU
JP12 patents
⚠️ This page may combine multiple inventors who share the name “NAKATA YOSHIROU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
5 patentsUS6005401ADec 21, 1999
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD140 citations98
US5945834AAug 31, 1999
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD160 citations98
US6323663B1Nov 27, 2001
Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD37 citations92
US7589543B2Sep 15, 2009
Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations83
US7170189B2Jan 30, 2007
Semiconductor wafer and testing method therefor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations72
PANASONIC CORP
4 patentsUS8638118B2Jan 28, 2014
Wafer inspection device
PANASONIC CORP2 citations62
US7982482B2Jul 19, 2011
Probe card, method of manufacturing the probe card and alignment method
PANASONIC CORP4 citations62
US7673205B2Mar 2, 2010
Semiconductor IC and testing method thereof
PANASONIC CORP2 citations61
US7768285B2Aug 3, 2010
Probe card for semiconductor IC test and method of manufacturing the same
PANASONIC CORP0 citations49