Inventor · disambiguated record
Tae Joon Chung
Also filed as: CHUNG TAE J · CHUNG TAE JOON
7 granted patents·7 pending applications·7 citations·filing 2006–2014
75Inventor score
Top patents by PatentIndex Score
14 records- 0161US8671564B2Substrate for flip chip bonding and method of fabricating the sameOH HUENG JAE·Filed 2009·Granted Mar 18, 2014·3 cites·8 claims
- 0261US8456003B2Package substrate capable of controlling the degree of warpageLEE DONG GYU·Filed 2010·Granted Jun 4, 2013·1 cites·6 claims
- 0360US8486760B2Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the sameCHUNG TAE JOON·Filed 2010·Granted Jul 16, 2013·2 cites·11 claims
- 0453US8994988B2Image forming apparatus, host apparatus, and print method thereofMIN SUN-KI·Filed 2011·Granted Mar 31, 2015·1 cites·29 claims
- 0552US8835302B2Method of fabricating a package substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 16, 2014·0 cites·8 claims
- 0649US2014138821A1Substrate for flip chip bonding and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0746US2010270067A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0845US2010044084A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0945US2010132998A1Substrate having metal post and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1043US2009205854A1Printed circuit board for a package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1141US2007062816A1Method of electroplating printed circuit board using magnetic field having periodic directionalitySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1239US9286552B2Image forming apparatus, image forming method, and computer-readable recording mediumSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 15, 2016·0 cites·22 claims
- 1339US8854655B2Image forming apparatus and method of generating additional information-added documentsCHUNG TAE-JOON·Filed 2010·Granted Oct 7, 2014·0 cites·20 claims
- 1437US2011133332A1Package substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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