Inventor · disambiguated record
Michiro Ogawa
Also filed as: OGAWA MICHIRO
7 granted patents·34 citations·filing 2009–2019
82Inventor score
Top patents by PatentIndex Score
7 records- 0186US8153902B2Wiring board and electronic component deviceNAKAMURA JUNICHI·Filed 2009·Granted Apr 10, 2012·11 cites·6 claims
- 0283US9257373B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 9, 2016·4 cites·6 claims
- 0382US8686298B2Wiring board and electronic component deviceNAKAMURA JUNICHI·Filed 2012·Granted Apr 1, 2014·4 cites·5 claims
- 0479US9232642B2Wiring substrate, method for manufacturing the wiring substrate, and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 5, 2016·6 cites·7 claims
- 0577US8399779B2Wiring board and method of manufacturing the sameOGAWA MICHIRO·Filed 2009·Granted Mar 19, 2013·8 cites·9 claims
- 0667US9024207B2Method of manufacturing a wiring board having pads highly resistant to peelingSHINKO ELECTRIC IND CO·Filed 2013·Granted May 5, 2015·1 cites·6 claims
- 0747US10524361B2Electronic component-embedded substrate and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2019·Granted Dec 31, 2019·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →