Inventor

CHEN LU-YI

TW18 patents

⚠️ This page may combine multiple inventors who share the name “CHEN LU-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN LU-YI

SILICONWARE PRECISION INDUSTRIES CO LTD

Substrate structure with first and second conductive bumps having different widths

Electronic package and fabrication method thereof

Fabrication method of semiconductor package with stacked semiconductor chips

Semiconductor package with stacked semiconductor chips

Carrier structure, packaging substrate, electronic package and fabrication method thereof

Fabrication method of semiconductor package with stacked semiconductor chips

Electrical testing method of interposer

Method for fabricating electronic package

Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate

Fabrication method of electronic module

Electronic module and fabrication method thereof

Method for fabricating electronic package

Fabrication method of electronic package

Electronic package and fabrication method thereof

Electronic package and method for fabricating the same

Electronic device

Package structure and fabrication method thereof

Chen lu yi

Interposer and electrical testing method thereof