Inventor

HARADA YUSUKE

JP30 patents

⚠️ This page may combine multiple inventors who share the name “HARADA YUSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HARADA YUSUKE

OKI ELECTRIC IND CO LTD

Semiconductor device having damascene interconnection structure that prevents void formation between interconnections

Semiconductor device having a multi-layered conductive structure which includes an aluminum alloy layer, a high melting temperature metal layer, and a high melting temperature nitride layer

Method of forming CVD titanium film

Semiconductor device having damascene interconnection structure that prevents void formation between interconnections

Semiconductor device

Method of manufacturing semiconductor devices having multi-layered structure

Method of forming a wiring pattern for a semiconductor device

Wiring structure of a semiconductor device with beta tungsten

Method of forming a patterned tungsten damascene interconnect

Semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Al/Ti layered interconnection and method of forming same

CHUGAI PHARMACEUTICAL CO LTD

Cephalosporin derivatives

Cephalosporin derivatives

Penicillanic acid derivatives

Cephalosporin derivatives

Cephalosporin derivatives

α-Substituted ureido-benzylpenicillanic acids

ROHM CO LTD

Electronic component having a heat dissipation member formed on a sealing member

Method of manufacturing semiconductor device with internal and external electrode

Semiconductor device with internal and external electrode and method of manufacturing

FUJI XEROX CO LTD

Method of wet honing a support for an electrophotographic photoreceptor

Electrophotographic photoreceptor and related method

OKI ELECTRIC INDUSTRY INC CO

Making a semiconductor device with contact holes having different depths

OKI SEMICONDUCTOR CO LTD

Semiconductor device having damascene interconnection structure that prevents void formation between interconnections

ELECTRIC INDUSTRY CO LTD

Semiconductor device having multi-layered metalization and method of manufacturing the same

JAPAN ELECTRONIC MAT CORPORATION

Probe-card multilayer wiring substrate and probe card

HARADA YUSUKE

Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate