Inventor
CHANG YI-CHUN
TW21 patents
⚠️ This page may combine multiple inventors who share the name “CHANG YI-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
12 patentsUS11996321B2May 28, 2024
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11664272B2May 30, 2023
Etch profile control of gate contact opening
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11961893B2Apr 16, 2024
Contacts for semiconductor devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12538777B2Jan 27, 2026
Fin field effect transistor (FinFET) having hourglass-shaped via structure on source/drain and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12349395B2Jul 1, 2025
Inter block for recessed contacts and methods forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12119386B2Oct 15, 2024
Conductive capping for work function layer and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12107003B2Oct 1, 2024
Etch profile control of gate contact opening
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12107007B2Oct 1, 2024
Recessed contacts at line end and methods forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11967622B2Apr 23, 2024
Inter block for recessed contacts and methods forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11749732B2Sep 5, 2023
Etch profile control of via opening
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11810919B2Nov 7, 2023
Semiconductor device structure with conductive via structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12363947B2Jul 15, 2025
Structure and formation method of semiconductor device with contact structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
UNITED MICROELECTRONICS CORP
3 patentsUS6001742ADec 14, 1999
Method for etching tantalum oxide layer
UNITED MICROELECTRONICS CORP26 citations92
US6232238B1May 15, 2001
Method for preventing corrosion of bonding pad on a surface of a semiconductor wafer
UNITED MICROELECTRONICS CORP40 citations90
US6136663AOct 24, 2000
Method of etching silicon nitride
UNITED MICROELECTRONICS CORP2 citations61
MINIWIZ CO LTD
3 patentsUS9949565B1Apr 24, 2018
Supporting assembly and furniture comprising the same
MINIWIZ CO LTD2 citations66
US10384373B2Aug 20, 2019
Mobile plastic recycling system and recycling method using the same
MINIWIZ CO LTD1 citations55
US11566422B2Jan 31, 2023
Structural joint and sealing element for panels
MINIWIZ CO LTD0 citations39