Inventor
GAMBA JASON M
US11 patents
Patents
11 patentsUS11521931B2Dec 6, 2022
Microelectronic structures including bridges
INTEL CORP7 citations84
US11302643B2Apr 12, 2022
Microelectronic component having molded regions with through-mold vias
INTEL CORP5 citations83
US12176292B2Dec 24, 2024
Microelectronic component having molded regions with through-mold vias
INTEL CORP2 citations72
US11817390B2Nov 14, 2023
Microelectronic component having molded regions with through-mold vias
INTEL CORP2 citations72
US11233009B2Jan 25, 2022
Embedded multi-die interconnect bridge having a molded region with through-mold vias
INTEL CORP2 citations70
US12068172B2Aug 20, 2024
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages
INTEL CORP0 citations61
US11640942B2May 2, 2023
Microelectronic component having molded regions with through-mold vias
INTEL CORP0 citations61
US12412868B2Sep 9, 2025
Microelectronic assemblies including interconnects with different solder materials
INTEL CORP0 citations60
US11688692B2Jun 27, 2023
Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias
INTEL CORP0 citations59
US11462432B2Oct 4, 2022
Dual side de-bonding in component carriers using photoablation
INTEL CORP0 citations55
US12517314B2Jan 6, 2026
High bandwidth optical interconnection architectures
INTEL CORP0 citations50