Inventor
NAGUMO YUJI
JP4 patents
Patents
4 patentsUS11881407B2Jan 23, 2024
Processed wafer and method of manufacturing chip formation wafer
DENSO CORP10 citations81
US12426329B2Sep 23, 2025
Silicon carbide semiconductor device including a side silicide layer and method for manufacturing the same
DENSO CORP0 citations54
US12501712B2Dec 16, 2025
Method of forming grooves and vertical cracks in a wafer comprising individual semiconductor elements to separate the semiconductor elements by cleaving the wafer along the grooves and the vertical cracks
DENSO CORP0 citations49
US12424496B2Sep 23, 2025
Manufacturing method of semiconductor device
DENSO CORP0 citations43