Inventor
CHANTRAINE PHILIPPE
FR5 patents
Patents
5 patentsUS4826786AMay 2, 1989
Method for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced thereby
BULL SA24 citations90
US5464653ANov 7, 1995
Method for interconnection of metal layers of the multilayer network of an electronic board, and the resultant board
BULL SA22 citations85
US4906592AMar 6, 1990
Method for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layer
BULL SA22 citations79
US5231757AAug 3, 1993
Method for forming the multi-layer structure of a connection board of at least one very large scale integrated circuit
BULL SA16 citations70
US5082718AJan 21, 1992
Method for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuit
BULL SA12 citations70