Inventor
MORING ALLEN F
US10 patents
Patents
10 patentsUS6178093B1Jan 23, 2001
Information handling system with circuit assembly having holes filled with filler material
IBM168 citations99
US5822856AOct 20, 1998
Manufacturing circuit board assemblies having filled vias
IBM223 citations99
US6138350AOct 31, 2000
Process for manufacturing a circuit board with filled holes
IBM37 citations96
US6000129ADec 14, 1999
Process for manufacturing a circuit with filled holes
IBM43 citations96
US6127025AOct 3, 2000
Circuit board with wiring sealing filled holes
IBM23 citations92
US5869356AFeb 9, 1999
Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate
IBM35 citations89
US5784260AJul 21, 1998
Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
IBM24 citations89
US6207354B1Mar 27, 2001
Method of making an organic chip carrier package
IBM16 citations83
US6114019ASep 5, 2000
Circuit board assemblies having filled vias free from bleed-out
IBM13 citations82
US4786528ANov 22, 1988
Process for treating reinforced polymer composite
IBM16 citations72