Inventor
WU PAUL Y F
US9 patents
Patents
9 patentsUS6034427AMar 7, 2000
Ball grid array structure and method for packaging an integrated circuit chip
PROLINX LABS CORP294 citations98
US5906042AMay 25, 1999
Method and structure to interconnect traces of two conductive layers in a printed circuit board
PROLINX LABS CORP203 citations98
US5872338AFeb 16, 1999
Multilayer board having insulating isolation rings
PROLINX LABS CORP125 citations97
US5962815AOct 5, 1999
Antifuse interconnect between two conducting layers of a printed circuit board
PROLINX LABS CORP70 citations96
US5537108AJul 16, 1996
Method and structure for programming fuses
PROLINX LABS CORP76 citations96
US5987744ANov 23, 1999
Method for supporting one or more electronic components
PROLINX LABS CORP54 citations95
US5767575AJun 16, 1998
Ball grid array structure and method for packaging an integrated circuit chip
PROLINX LABS CORP82 citations95
US5726482AMar 10, 1998
Device-under-test card for a burn-in board
PROLINX LABS CORP20 citations92
US5906043AMay 25, 1999
Programmable/reprogrammable structure using fuses and antifuses
PROLINX LABS CORP10 citations73