Inventor
POH YANG LIANG
MY5 patents
Patents
5 patentsUS12191281B2Jan 7, 2025
Multi-chip package with recessed memory
INTEL CORP0 citations61
US11887917B2Jan 30, 2024
Encapsulated vertical interconnects for high-speed applications and methods of assembling same
INTEL CORP0 citations61
US11049801B2Jun 29, 2021
Encapsulated vertical interconnects for high-speed applications and methods of assembling same
INTEL CORP0 citations61
US11545434B2Jan 3, 2023
Vertical die-to-die interconnects bridge
INTEL CORP0 citations60
US11456516B2Sep 27, 2022
Low loss high-speed interconnects
INTEL CORP0 citations38