Inventor · disambiguated record
Paul S. Andry
Also filed as: ANDRY PAUL · ANDRY PAUL S · ANDRY PAUL STEPHEN
129 granted patents·13 pending applications·1,226 citations·filing 1999–2021
99Inventor score
Top patents by PatentIndex Score
142 records- 0199US7990711B1Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plateIBM·Filed 2010·Granted Aug 2, 2011·142 cites·25 claims
- 0298US10118250B1In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding methodIBM·Filed 2017·Granted Nov 6, 2018·12 cites·13 claims
- 0398US7488680B2Conductive through via process for electronic device carriersIBM·Filed 2005·Granted Feb 10, 2009·87 cites·11 claims
- 0497US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0596US9029238B2Advanced handler wafer bonding and debondingIBM·Filed 2012·Granted May 12, 2015·26 cites·20 claims
- 0695US10381255B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2018·Granted Aug 13, 2019·7 cites·11 claims
- 0795US9472789B2Thin, flexible microsystem with integrated energy sourceIBM·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 0895US9412663B1Dies for RFID devices and sensor applicationsIBM·Filed 2015·Granted Aug 9, 2016·11 cites·16 claims
- 0995US8855452B2Silicon photonic chip optical coupling structuresANDRY PAUL S·Filed 2012·Granted Oct 7, 2014·26 cites·23 claims
- 1095US7230334B2Semiconductor integrated circuit chip packages having integrated microchannel cooling modulesIBM·Filed 2004·Granted Jun 12, 2007·66 cites·25 claims
- 1194US10224229B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2016·Granted Mar 5, 2019·8 cites·8 claims
- 1293US8115302B2Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling deviceANDRY PAUL S·Filed 2008·Granted Feb 14, 2012·19 cites·15 claims
- 1393US6620719B1Method of forming ohmic contacts using a self doping layer for thin-film transistorsIBM·Filed 2000·Granted Sep 16, 2003·82 cites·27 claims
- 1492US9822002B1Flexible electronics for wearable healthcare sensorsIBM·Filed 2016·Granted Nov 21, 2017·5 cites·20 claims
- 1592US7741226B2Optimal tungsten through wafer via and process of fabricating sameIBM·Filed 2008·Granted Jun 22, 2010·31 cites·22 claims
- 1691US9324601B1Low temperature adhesive resins for wafer bondingIBM·Filed 2014·Granted Apr 26, 2016·8 cites·12 claims
- 1791US8138036B2Through silicon via and method of fabricating sameANDRY PAUL STEPHEN·Filed 2008·Granted Mar 20, 2012·18 cites·16 claims
- 1890US9159602B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersANDRY PAUL S·Filed 2009·Granted Oct 13, 2015·14 cites·13 claims
- 1990US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 2090US7948077B2Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangementIBM·Filed 2008·Granted May 24, 2011·13 cites·19 claims
- 2189US9059161B2Composite wiring board with electrical through connectionsIBM·Filed 2012·Granted Jun 16, 2015·11 cites·13 claims
- 2289US8487425B2Optimized annular copper TSVANDRY PAUL S·Filed 2011·Granted Jul 16, 2013·9 cites·15 claims
- 2389US7645701B2Silicon-on-insulator structures for through via in silicon carriersIBM·Filed 2007·Granted Jan 12, 2010·15 cites·16 claims
- 2488US8637937B2Through silicon via for use in integrated circuit chipsANDRY PAUL STEPHEN·Filed 2012·Granted Jan 28, 2014·7 cites·16 claims
- 2588US8198734B2Silicon-on-insulator structures for through via in silicon carriersANDERSON BRENT A·Filed 2009·Granted Jun 12, 2012·14 cites·12 claims
- 2688US7888786B2Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling deviceIBM·Filed 2007·Granted Feb 15, 2011·11 cites·19 claims
- 2788US7678696B2Method of making through wafer viasIBM·Filed 2008·Granted Mar 16, 2010·16 cites·20 claims
- 2887US11824037B2Assembly of a chip to a substrateIBM·Filed 2020·Granted Nov 21, 2023·2 cites·4 claims
- 2987US10166632B1In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding methodIBM·Filed 2017·Granted Jan 1, 2019·2 cites·7 claims
- 3087US9947570B2Handler bonding and debonding for semiconductor diesIBM·Filed 2016·Granted Apr 17, 2018·3 cites·16 claims
- 3187US8012796B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersIBM·Filed 2009·Granted Sep 6, 2011·11 cites·5 claims
- 3286US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 3386US6724449B1Vertical aligned liquid crystal display and method using dry deposited alignment layer filmsIBM·Filed 2000·Granted Apr 20, 2004·31 cites·66 claims
- 3485US8658535B2Optimized annular copper TSVIBM·Filed 2013·Granted Feb 25, 2014·8 cites·11 claims
- 3584US10325785B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Jun 18, 2019·2 cites·9 claims
- 3684US9684862B2Microelectronic smart tagsIBM·Filed 2015·Granted Jun 20, 2017·3 cites·20 claims
- 3784US9418895B1Dies for RFID devices and sensor applicationsIBM·Filed 2015·Granted Aug 16, 2016·3 cites·4 claims
- 3884US9200883B2Transferable probe tipsANDRY PAUL S·Filed 2011·Granted Dec 1, 2015·5 cites·22 claims
- 3984US8735251B2Through silicon via and method of fabricating sameULTRATECH INC·Filed 2013·Granted May 27, 2014·5 cites·11 claims
- 4084US8298917B2Process for wet singulation using a dicing singulation structureANDRY PAUL S·Filed 2009·Granted Oct 30, 2012·9 cites·19 claims
- 4183US9362223B2Integrated circuit assembly with cushion polymer layerIBM·Filed 2015·Granted Jun 7, 2016·4 cites·7 claims
- 4283US8263497B2High-yield method of exposing and contacting through-silicon viasANDRY PAUL S·Filed 2009·Granted Sep 11, 2012·11 cites·18 claims
- 4382US10224219B2Handler bonding and debonding for semiconductor diesIBM·Filed 2015·Granted Mar 5, 2019·2 cites·14 claims
- 4482US8592932B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersANDRY PAUL S·Filed 2012·Granted Nov 26, 2013·4 cites·8 claims
- 4582US8295056B2Silicon carrier structure and method of forming sameANDRY PAUL STEPHEN·Filed 2009·Granted Oct 23, 2012·9 cites·15 claims
- 4682US6338988B1Method for fabricating self-aligned thin-film transistors to define a drain and source in a single photolithographic stepIBM·Filed 1999·Granted Jan 15, 2002·50 cites·20 claims
- 4781US8440544B2CMOS structure and method of manufactureANDRY PAUL S·Filed 2010·Granted May 14, 2013·4 cites·21 claims
- 4880US9312761B2Three-D power converter in three distinct strataIBM·Filed 2014·Granted Apr 12, 2016·3 cites·25 claims
- 4979US10622590B2Method of forming a homogeneous solid metallic anode for a thin film microbatteryIBM·Filed 2018·Granted Apr 14, 2020·0 cites·17 claims
- 5079US9748131B2Low temperature adhesive resins for wafer bondingIBM·Filed 2015·Granted Aug 29, 2017·2 cites·13 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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