Inventor
BRODSKY COLIN J
US27 patents
⚠️ This page may combine multiple inventors who share the name “BRODSKY COLIN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS7310585B2Dec 18, 2007
Method of inspecting integrated circuits during fabrication
IBM17 citations92
US7799503B2Sep 21, 2010
Composite structures to prevent pattern collapse
IBM31 citations91
US7083898B1Aug 1, 2006
Method for performing chemical shrink process over BARC (bottom anti-reflective coating)
IBM11 citations84
US7588879B2Sep 15, 2009
Graded spin-on organic antireflective coating for photolithography
IBM15 citations83
US7239371B2Jul 3, 2007
Density-aware dynamic leveling in scanning exposure systems
IBM12 citations83
US7786017B1Aug 31, 2010
Utilizing inverse reactive ion etching lag in double patterning contact formation
IBM19 citations81
US7229936B2Jun 12, 2007
Method to reduce photoresist pattern collapse by controlled surface microroughening
IBM8 citations73
US7816069B2Oct 19, 2010
Graded spin-on organic antireflective coating for photolithography
IBM7 citations72
US7288478B2Oct 30, 2007
Method for performing chemical shrink process over BARC (bottom anti-reflective coating)
IBM5 citations71
US7494919B2Feb 24, 2009
Method for post lithographic critical dimension shrinking using thermal reflow process
IBM4 citations63
US7390616B2Jun 24, 2008
Method for post lithographic critical dimension shrinking using post overcoat planarization
IBM6 citations62
US7354779B2Apr 8, 2008
Topography compensated film application methods
IBM4 citations62
US7267863B2Sep 11, 2007
Film stack having under layer for preventing pinhole defects
IBM3 citations61
US7493186B2Feb 17, 2009
Method and algorithm for the control of critical dimensions in a thermal flow process
IBM2 citations60
US7824846B2Nov 2, 2010
Tapered edge bead removal process for immersion lithography
IBM1 citations52
US8023102B2Sep 20, 2011
Test method for determining reticle transmission stability
IBM1 citations51
US7541065B2Jun 2, 2009
Method of forming film stack having under layer for preventing pinhole defects
IBM0 citations51
US7473461B2Jan 6, 2009
Film stack having under layer for preventing pinhole defects
IBM0 citations51
US7454302B2Nov 18, 2008
Method of inspecting integrated circuits during fabrication
IBM0 citations51
US7132316B2Nov 7, 2006
After deposition method of thinning film to reduce pinhole defects
IBM1 citations51
US7632631B2Dec 15, 2009
Method of preventing pinhole defects through co-polymerization
IBM0 citations39
US9059194B2Jun 16, 2015
High-K and metal filled trench-type EDRAM capacitor with electrode depth and dimension control
IBM0 citations35