Inventor
Liu wen-fang
TW15 patents
⚠️ This page may combine multiple inventors who share the name “Liu wen-fang”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
8 patentsUS10039184B2Jul 31, 2018
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP9 citations82
US10356901B2Jul 16, 2019
Manufacturing method of circuit board structure
UNIMICRON TECHNOLOGY CORP4 citations71
US10497847B2Dec 3, 2019
Structure and manufacturing method of heat dissipation substrate and package structure and method thereof
UNIMICRON TECHNOLOGY CORP2 citations70
US10056356B1Aug 21, 2018
Chip package circuit board module
UNIMICRON TECHNOLOGY CORP5 citations70
US8979372B2Mar 17, 2015
Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US10813231B2Oct 20, 2020
Method for manufacturing circuit board
UNIMICRON TECHNOLOGY CORP0 citations50
US10477701B2Nov 12, 2019
Circuit board and method for manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations50
US10159151B1Dec 18, 2018
Chip package circuit board module
UNIMICRON TECHNOLOGY CORP1 citations48
TSENG TZYY-JANG
4 patentsUS8288662B2Oct 16, 2012
Circuit structure
TSENG TZYY-JANG2 citations62
US8247705B2Aug 21, 2012
Circuit substrate and manufacturing method thereof
TSENG TZYY-JANG0 citations51
US8598463B2Dec 3, 2013
Circuit board and manufacturing method thereof
TSENG TZYY-JANG0 citations41
US8161638B2Apr 24, 2012
Manufacturing method of circuit structure
TSENG TZYY-JANG0 citations41