Inventor
TAI CHIEW LI
MY7 patents
⚠️ This page may combine multiple inventors who share the name “TAI CHIEW LI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
6 patentsUS11075185B2Jul 27, 2021
Semiconductor package with multi-level conductive clip for top side cooling
INFINEON TECHNOLOGIES AG4 citations70
US10971436B2Apr 6, 2021
Multi-branch terminal for integrated circuit (IC) package
INFINEON TECHNOLOGIES AG0 citations59
US10354943B1Jul 16, 2019
Multi-branch terminal for integrated circuit (IC) package
INFINEON TECHNOLOGIES AG0 citations48
US10978380B2Apr 13, 2021
Semiconductor package with multi-level conductive clip for top side cooling
INFINEON TECHNOLOGIES AG0 citations47
US10083899B2Sep 25, 2018
Semiconductor package with heat slug and rivet free die attach area
INFINEON TECHNOLOGIES AG1 citations45
US10431526B2Oct 1, 2019
Rivetless lead fastening for a semiconductor package
INFINEON TECHNOLOGIES AG0 citations34