Inventor
YANG PING-JUNG
TW14 patents
⚠️ This page may combine multiple inventors who share the name “YANG PING-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YANG PING JUNG
7 patentsUS11538763B2Dec 27, 2022
Chip package
YANG PING JUNG4 citations82
US10622310B2Apr 14, 2020
Method for fabricating glass substrate package
YANG PING JUNG5 citations82
US12062618B2Aug 13, 2024
Chip package
YANG PING JUNG2 citations71
US11894306B2Feb 6, 2024
Chip package
YANG PING JUNG2 citations71
US11107768B2Aug 31, 2021
Chip package
YANG PING JUNG0 citations61
US10096565B2Oct 9, 2018
Method for fabricating glass substrate package
YANG PING JUNG1 citations61
US10453819B2Oct 22, 2019
Method for fabricating glass substrate package
YANG PING JUNG0 citations51
YANG PING-JUNG
3 patentsUS9615453B2Apr 4, 2017
Method for fabricating glass substrate package
YANG PING-JUNG12 citations82
US8837872B2Sep 16, 2014
Waveguide structures for signal and/or power transmission in a semiconductor device
YANG PING-JUNG8 citations82
US8431977B2Apr 30, 2013
Wafer level processing method and structure to manufacture semiconductor chip
YANG PING-JUNG8 citations82