Inventor
LYNE KEVIN
US5 patents
Patents
5 patentsUS6285560B1Sep 4, 2001
Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified
TEXAS INSTRUMENTS INC107 citations94
US6689634B1Feb 10, 2004
Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability
TEXAS INSTRUMENTS INC67 citations93
US8957525B2Feb 17, 2015
3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor
TEXAS INSTRUMENTS INC27 citations91
US8053349B2Nov 8, 2011
BGA package with traces for plating pads under the chip
TEXAS INSTRUMENTS INC3 citations59
US9312253B2Apr 12, 2016
Heterogeneous integration of memory and split-architecture processor
TEXAS INSTRUMENTS INC0 citations50