Inventor

TSAO PEI-HWA

TW2 patents

Patents

2 patents

US6372619B1Apr 16, 2002

Method for fabricating wafer level chip scale package with discrete package encapsulation

TAIWAN SEMICONDUCTOR MFG64 citations92

US7154185B2Dec 26, 2006

Encapsulation method for SBGA

TAIWAN SEMICONDUCTOR MFG6 citations60