Inventor

PORTER DAVID W

US54 patents

⚠️ This page may combine multiple inventors who share the name “PORTER DAVID W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PORTER DAVID W

NOVELLUS SYSTEMS INC

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Wet etching methods for copper removal and planarization in semiconductor processing

Electroplating apparatus and process for wafer level packaging

Electroplating apparatus for tailored uniformity profile

Electroplating apparatus and process for wafer level packaging

Apparatus for wetting pretreatment for enhanced damascene metal filling

Electrofill vacuum plating cell

Protecting anodes from passivation in alloy plating systems

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Wet etching methods for copper removal and planarization in semiconductor processing

Electroplating apparatus for tailored uniformity profile

Wet etching methods for copper removal and planarization in semiconductor processing

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Protecting anodes from passivation in alloy plating systems

Electroplating apparatus for tailored uniformity profile

Protecting anodes from passivation in alloy plating systems

Wetting pretreatment for enhanced damascene metal filling

Electrolyte loop with pressure regulation for separated anode chamber of electroplating system

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Dynamic current distribution control apparatus and method for wafer electroplating

Dynamic current distribution control apparatus and method for wafer electroplating

Electroplating apparatus for tailored uniformity profile

Reduced isotropic etchant material consumption and waste generation

MAYER STEVEN T

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Wetting pretreatment for enhanced damascene metal filling

Electroplating apparatus for tailored uniformity profile

Electroplating apparatus and process for wafer level packaging

Reduced isotropic etchant material consumption and waste generation

Modulated metal removal using localized wet etching

LAM RES CORP

Selective deposition with atomic layer etch reset

Selective deposition with atomic layer etch reset

Bubble and foam solutions using a completely immersed air-free feedback flow control valve

TSV bath evaluation using field versus feature contrast

Bubble and foam solutions using a completely immersed air-free feedback flow control valve

TSV bath evaluation using field versus feature contrast

MCELROY MFG INC

Self-contained and self-propelled machine for heat fusing polyolefin pipes

Self-contained and self-propelled machine for heat fusing polyolefin pipes

Top-loading straddle-mounted pipe fusion machine

Top-loading straddle-mounted pipe fusion machine

Top-loading straddle-mounted pipe fusion machine

COLEMAN RESEARCH CORP

Apparatus and method for fusing diverse data

Data fusion workstation

MCELROY MANUFACTURING INC

Self-contained and self-propelled machine for heat fusing polyolefin pipes

Self-contained and self-propelled machine and method for heat fusing polyolefin pipes

GLEASMAN VERNON E

Variable hydraulic machine

RASH ROBERT

Electrolyte loop with pressure regulation for separated anode chamber of electroplating system

(unassigned)

Hydraulic machine with gear-mounted swash-plate

PORTER DAVID W

Dynamic current distribution control apparatus and method for wafer electroplating

UNIV JOHNS HOPKINS

Pattern discovery through reversing time flow