Inventor
LEE SEUNG SEOUP
KR18 patents
⚠️ This page may combine multiple inventors who share the name “LEE SEUNG SEOUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LEE SEUNG SEOUP
11 patentsUS8666126B2Mar 4, 2014
Fingerprint detection sensor and method of detecting fingerprint
LEE SEUNG SEOUP93 citations95
US8736139B2May 27, 2014
Optical image stabilizer and method of manufacturing the same
LEE SEUNG SEOUP25 citations91
US8656582B2Feb 25, 2014
Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer
LEE SEUNG SEOUP4 citations71
US8410465B2Apr 2, 2013
Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor
LEE SEUNG SEOUP3 citations59
US8111389B2Feb 7, 2012
Method of inspecting defects in circuit pattern of substrate
LEE SEUNG SEOUP2 citations59
US9060734B2Jun 23, 2015
Fixed focus transducer array and ultrasonic wave transceiving apparatus using the same
LEE SEUNG SEOUP0 citations51
US8624618B2Jan 7, 2014
Apparatus and method for inspecting circuit of substrate
LEE SEUNG SEOUP0 citations51
US8593532B2Nov 26, 2013
Optical image stabilizer employing a scratch drive actuator
LEE SEUNG SEOUP0 citations51
US8283251B2Oct 9, 2012
Method of manufacturing wafer level package
LEE SEUNG SEOUP1 citations51
US8614391B2Dec 24, 2013
Device for converting energy and method for manufacturing the device, and electronic apparatus with the device
LEE SEUNG SEOUP0 citations40
US8471581B2Jun 25, 2013
Apparatus and method for inspecting defects in circuit pattern of substrate
LEE SEUNG SEOUP0 citations38
SAMSUNG ELECTRO MECH
7 patentsUS9128350B1Sep 8, 2015
Micro-iris unit and camera module including the same
SAMSUNG ELECTRO MECH5 citations72
US7982982B2Jul 19, 2011
Wafer level packaging image sensor module having lens actuator and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations62
US9153641B2Oct 6, 2015
Wafer level package having cylindrical capacitor and method of fabricating the same
SAMSUNG ELECTRO MECH2 citations61
US9502464B2Nov 22, 2016
Method of manufacturing optical image stabilizer
SAMSUNG ELECTRO MECH0 citations51
US8921146B2Dec 30, 2014
Method for manufacturing optical image stabilizer employing scratch drive actuator
SAMSUNG ELECTRO MECH0 citations51
US8378452B2Feb 19, 2013
Wafer level package having cylindrical capacitor and method of fabricating the same
SAMSUNG ELECTRO MECH1 citations50
US9331070B2May 3, 2016
Variable capacitor and integrated circuit including the same
SAMSUNG ELECTRO MECH0 citations40