Inventor · disambiguated record
Norman W. Robson
Also filed as: ROBSON NORMAN · ROBSON NORMAN W · ROBSON NORMAN WHITELAW
20 granted patents·4 pending applications·74 citations·filing 2002–2024
92Inventor score
Files withGLOBALFOUNDRIES US INC7IBM6INFINEON TECHNOLOGIES AG2KOTHANDARAMAN CHANDRASEKHARAN2COOLBAUGH DOUGLAS D1
Top patents by PatentIndex Score
24 records- 0187US8159040B2Metal gate integration structure and method including metal fuse, anti-fuse and/or resistorCOOLBAUGH DOUGLAS D·Filed 2008·Granted Apr 17, 2012·15 cites·21 claims
- 0285US8590010B2Retention based intrinsic fingerprint identification featuring a fuzzy algorithm and a dynamic keyFAINSTEIN DANIEL J·Filed 2011·Granted Nov 19, 2013·15 cites·13 claims
- 0380US9029234B2Physical design symmetry and integrated circuits enabling three dimentional (3D) yield optimization for wafer to wafer stackingSAFRAN JOHN MATTHEW·Filed 2012·Granted May 12, 2015·8 cites·26 claims
- 0480US8350264B2Secure anti-fuse with low voltage programming through localized diffusion heatingINTERNAT BUSINESSS MACHINES CORP·Filed 2010·Granted Jan 8, 2013·5 cites·20 claims
- 0572US8004060B2Metal gate compatible electrical antifuseIBM·Filed 2007·Granted Aug 23, 2011·5 cites·8 claims
- 0667US12449596B2Optical input/output interfaces between photonics chipsGLOBALFOUNDRIES US INC·Filed 2023·Granted Oct 21, 2025·0 cites·19 claims
- 0767US10685705B2Program and erase memory structuresGLOBALFOUNDRIES INC·Filed 2018·Granted Jun 16, 2020·1 cites·20 claims
- 0866US6882202B2Multiple trip point fuse latch device and methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 19, 2005·15 cites·17 claims
- 0962US9658255B2Signal monitoring of through-wafer vias using a multi-layer inductorIBM·Filed 2015·Granted May 23, 2017·1 cites·20 claims
- 1060US12332480B2Identification systemGLOBALFOUNDRIES US INC·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 1157US2025076575A1Fan-out co-packaged integrated systems including a photonic integrated circuitGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1255US2025164707A1Structures for a photonics chip that enable external communicationGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 1352US11367734B2Charge trap memory devicesGLOBALFOUNDRIES US INC·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
- 1452US9372208B2Signal monitoring of through-wafer vias using a multi-layer inductorIBM·Filed 2014·Granted Jun 21, 2016·0 cites·19 claims
- 1552US2025334758A1Electro-optic bridge chips for chip-to-chip communicationGLOBALFOUNDRIES US INC·Filed 2024·Application pending·0 cites
- 1650US12436334B2Photonics chip structures including a light source and an edge couplerGLOBALFOUNDRIES US INC·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 1750US7111257B2Using a partial metal level mask for early test resultsIBM·Filed 2003·Granted Sep 19, 2006·5 cites·9 claims
- 1849US8569755B2Secure anti-fuse with low voltage programming through localized diffusion heatingLi yan zun·Filed 2012·Granted Oct 29, 2013·0 cites·14 claims
- 1949US8519507B2Electrically programmable fuse using anisometric contacts and fabrication methodKOTHANDARAMAN CHANDRASEKHARAN·Filed 2009·Granted Aug 27, 2013·0 cites·11 claims
- 2046US2009267179A1System for power performance optimization of multicore processor chipIBM·Filed 2008·Application pending·0 cites
- 2145US9194912B2Circuits for self-reconfiguration or intrinsic functional changes of chips before vs. after stackingIBM·Filed 2012·Granted Nov 24, 2015·0 cites·21 claims
- 2245US8629049B2Electrically programmable fuse using anisometric contacts and fabrication methodKOTHANDARAMAN CHANDRASEKHARAN·Filed 2012·Granted Jan 14, 2014·0 cites·7 claims
- 2345US6957372B2Repair of address-specific leakageINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 18, 2005·4 cites·18 claims
- 2443US8975910B2Through-silicon-via with sacrificial dielectric lineGRAVES-ABE TROY L·Filed 2012·Granted Mar 10, 2015·0 cites·24 claims
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