Inventor · disambiguated record
Xiaoming Sui
Also filed as: SUI XIAOMING
3 granted patents·15 citations·filing 2015–2019
59Inventor score
Top patents by PatentIndex Score
3 records- 0191US9437528B1Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereofALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2015·Granted Sep 6, 2016·15 cites·19 claims
- 0247US11062969B2Wafer level chip scale package structure and manufacturing method thereofALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Jul 13, 2021·0 cites·4 claims
- 0346US10242926B2Wafer level chip scale package structure and manufacturing method thereofALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2016·Granted Mar 26, 2019·0 cites·19 claims
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