Inventor · disambiguated record
Nicolas Heuck
Also filed as: HEUCK NICOLAS
4 granted patents·1 pending application·14 citations·filing 2012–2016
66Inventor score
Top patents by PatentIndex Score
5 records- 0180US8835299B2Pre-sintered semiconductor die structureSPECKELS ROLAND·Filed 2012·Granted Sep 16, 2014·10 cites·20 claims
- 0276US9659793B2Method for producing a material-bonding connection between a semiconductor chip and a metal layerINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 23, 2017·4 cites·16 claims
- 0346US10615138B2Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methodsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 7, 2020·0 cites·20 claims
- 0430US11081464B2Method for producing an integral join and automatic placement machineINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 3, 2021·0 cites·12 claims
- 0527US2015257280A1Method for producing a dried paste layer, method for producing a sintering connection, method for producing a power semiconductor module and continuous installationINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →