P

Inventor

KIKUCHI HIROAKI

JP96 patents
⚠️ This page may combine multiple inventors who share the name “KIKUCHI HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

15 patents
US6096433AAug 1, 2000

Laminated substrate fabricated from semiconductor wafers bonded to each other without contact between insulating layer and semiconductor layer and process of fabrication thereof

NEC CORP57 citations96
US5985681ANov 16, 1999

Method of producing bonded substrate with silicon-on-insulator structure

NEC CORP64 citations96
US5298449AMar 29, 1994

Semiconductor substrate having a silicon-on-insulator structure and method of fabricating the same

NEC CORP85 citations96
US6204075B1Mar 20, 2001

Method of detecting defects in a wiring process

NEC CORP21 citations93
US5844294ADec 1, 1998

Semiconductor substrate with SOI structure

NEC CORP31 citations93
US6496788B1Dec 17, 2002

Data processing method and apparatus to determine killer ratio based on a variety of defect types

NEC CORP14 citations84
US5894037AApr 13, 1999

Silicon semiconductor substrate and method of fabricating the same

NEC CORP17 citations84
US6495856B2Dec 17, 2002

Semiconductor device having a test pattern same as conductive pattern to be tested and method for testing semiconductor device for short-circuit

NEC CORP12 citations74
US6346435B1Feb 12, 2002

Laminated substrate fabricated from semiconductor wafers bonded to each other without contact between insulating layer and semiconductor layer and process of fabrication thereof

NEC CORP7 citations74
US5847438ADec 8, 1998

Bonded IC substrate with a high breakdown voltage and large current capabilities

NEC CORP14 citations74
US5753353AMay 19, 1998

Soi Substrate

NEC CORP10 citations74
US5374582ADec 20, 1994

Laminated substrate for semiconductor device and manufacturing method thereof

NEC CORP16 citations74
US6563321B2May 13, 2003

Method and apparatus for detecting line-shorts by potential and temperature distribution

NEC CORP2 citations63
US5999006ADec 7, 1999

Method of and apparatus for conducting analysis of buried oxides

NEC CORP5 citations63
US5285101AFeb 8, 1994

Semiconductor device

NEC CORP5 citations63

FUJITSU LTD

5 patents

IBM

5 patents

MITSUBISHI ELECTRIC CORP

3 patents

SONY CORP

3 patents

TOYO SEIKAN KAISHA LTD

2 patents

KIKUCHI HIROAKI

2 patents

FUJIFILM CORP

2 patents

CROWN CORK JAPAN

1 patent

OKI DATA KK

1 patent

TYCO ELECTRONICS JAPAN G K

1 patent

JTEKT CORP

1 patent

JAMCO CORP

1 patent

NIPPON TELEGRAPH & TELEPHONE

1 patent

TOYO SEIKAN GROUP HOLDINGS LTD

1 patent

MITSUBISHI MATERIALS CORP

1 patent

HONDA MOTOR CO LTD

1 patent

SUBAGYO AGUS

1 patent

FUJI PHOTO FILM CO LTD

1 patent

HITACHI CHEMICAL CO LTD

1 patent

SONY GROUP CORP

1 patent

Showing the top 50 of 96 patents by PatentIndex Score.