Inventor

TEMPLETON MICHAEL K

US93 patents

⚠️ This page may combine multiple inventors who share the name “TEMPLETON MICHAEL K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEMPLETON MICHAEL K

ADVANCED MICRO DEVICES INC

Parallel plate development with multiple holes in top plate for control of developer flow and pressure

Chemical feature doubling process

Critical dimension monitoring from latent image

Chemical trim process

Developer soluble dyed BARC for dual damascene process

Multiple nozzles for dispensing resist

Sidewall formation for sidewall patterning of sub 100 nm structures

Systems and methods to determine seed layer thickness of trench sidewalls

Scatterometry based measurements of a rotating substrate

Scatterometry techniques to ascertain asymmetry profile of features and generate a feedback or feedforward process control data associated therewith

Carbon nanotubes as linewidth standards for SEM &amp; AFM

Use of carbon nanotubes to calibrate conventional tips used in AFM

CVD plasma process to fill contact hole in damascene process

Barcode marking of wafer products for inventory control

Dual layer patterning scheme to make dual damascene

Pinhole defect repair by resist flow

System and method for active control of BPSG deposition

Interlayer dielectric void detection

Acoustic microbalance for in-situ deposition process monitoring and control

Scatterometry based measurements of a moving substrate

Growing a dual damascene structure using a copper seed layer and a damascene resist structure

Non self-aligned shallow trench isolation process with disposable space to define sub-lithographic poly space

Treat resist surface to prevent pattern collapse

Scattered signal collection using strobed technique

Using scatterometry for etch end points for dual damascene process

Grainless material for calibration sample

UV-enhanced silylation process to increase etch resistance of ultra thin resists

Deliberate void in innerlayer dielectric gapfill to reduce dielectric constant

Non-charging critical dimension SEM metrology standard

Method to produce high density memory cells and small spaces by using nitride spacer

Use of silicon oxynitride ARC for metal layers

Nozzle arm movement for resist development

Nozzle arm movement for resist development

Active control of temperature in scanning probe lithography and maskless lithograpy

Lithographic mask repair using a scanning tunneling microscope

System for uniformly heating photoresist

Calibration of CD-SEM by e-beam induced current measurement

Electric measurement of reference sample in a CD-SEM and method for calibration

Sidewall formation for sidewall patterning of sub 100 nm structures

Chemical resist thickness reduction process

System and method for wafer alignment which mitigates effects of reticle rotation and magnification on overlay

In situ particle monitoring for defect reduction

System for rapidly and uniformly cooling resist

Apparatus of monitoring and optimizing the development of a photoresist material

Method and system for decreasing the spaces between wordlines

Parallel plate development

Low k ILD process by removable ILD

ADVANCE MICRO DEVICES INC

Re-circulation and reuse of dummy-dispensed resist

SHIPLEY CO

Quinone diazide containing photoresist composition utilizing mixed solvent of ethyl lactate, anisole and amyl acetate

GLOBALFOUNDRIES INC

Inverse resist coating process

Carbon nanotubes as linewidth standards for SEM & AFM