P

Inventor

HIRATANI MASAHIKO

JP39 patents
⚠️ This page may combine multiple inventors who share the name “HIRATANI MASAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

23 patents
US6451665B1Sep 17, 2002

Method of manufacturing a semiconductor integrated circuit

HITACHI LTD66 citations96
US6326218B1Dec 4, 2001

Semiconductor integrated circuit and its manufacturing method

HITACHI LTD46 citations96
US4645726AFeb 24, 1987

Solid state lithium battery

HITACHI LTD117 citations96
US6576928B2Jun 10, 2003

Semiconductor device capacitor with high permittivity tantalum pentoxide/niobium pentoxide dielectric

HITACHI LTD20 citations92
US6555429B2Apr 29, 2003

Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device

HITACHI LTD19 citations92
US6503791B2Jan 7, 2003

Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device

HITACHI LTD21 citations92
US5380704AJan 10, 1995

Superconducting field effect transistor with increased channel length

HITACHI LTD20 citations92
US5077266ADec 31, 1991

Method of forming weak-link josephson junction, and superconducting device employing the junction

HITACHI LTD25 citations92
US6544834B1Apr 8, 2003

Method of forming a semiconductor device including a capacitor with tantalum oxide (Ta2O5)

HITACHI LTD26 citations90
US6867090B2Mar 15, 2005

Semiconductor device and method of manufacturing thereof

HITACHI LTD13 citations84
US6534375B2Mar 18, 2003

Method of forming a capacitor in a semiconductor integrated circuit device using a metal silicon nitride layer to protect an underlying metal silicide layer from oxidation during subsequent processing steps

HITACHI LTD14 citations83
US6521494B2Feb 18, 2003

Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device

HITACHI LTD7 citations74
US6509246B2Jan 21, 2003

Production of semiconductor integrated circuit

HITACHI LTD7 citations74
US6483143B2Nov 19, 2002

Semiconductor device having a capacitor structure including a self-alignment deposition preventing film

HITACHI LTD11 citations74
US6720603B2Apr 13, 2004

Capacitor structure and a semiconductor device with a first metal layer, a second metal silicide layer formed over the first metal layer and a second metal layer formed over the second metal silicide layer

HITACHI LTD11 citations73
US6664157B2Dec 16, 2003

Semiconductor integrated circuit device and the method of producing the same

HITACHI LTD7 citations73
US5250506AOct 5, 1993

Superconductive switching element with semiconductor channel

HITACHI LTD14 citations73
US5914068AJun 22, 1999

Bi-layer oxide ferroelectrics

HITACHI LTD15 citations72
US6144052ANov 7, 2000

Semiconductor device and its manufacture

HITACHI LTD13 citations71
US5151409ASep 29, 1992

Superconducting composition comprising ln-th-cu-o, wherein ln is pr, nd, pm, sm, eu, gd, er or mixtures thereof

HITACHI LTD7 citations66
US6583023B2Jun 24, 2003

Method for making semiconductor integrated circuits

HITACHI LTD2 citations63
US6713343B2Mar 30, 2004

Method of forming a semiconductor device with a capacitor including a polycrystalline tantalum oxide film dielectric

HITACHI LTD3 citations60
US6693792B2Feb 17, 2004

Semiconductor integrated circuits and fabricating method thereof

HITACHI LTD0 citations52

RENESAS TECH CORP

13 patents
US6743739B2Jun 1, 2004

Fabrication method for semiconductor integrated devices

RENESAS TECH CORP47 citations96
US7408218B2Aug 5, 2008

Semiconductor device having plural dram memory cells and a logic circuit

RENESAS TECH CORP30 citations93
US6833577B2Dec 21, 2004

Semiconductor device

RENESAS TECH CORP16 citations92
US6787451B2Sep 7, 2004

Semiconductor device and manufacturing method thereof

RENESAS TECH CORP18 citations91
US6992022B2Jan 31, 2006

Fabrication method for semiconductor integrated devices

RENESAS TECH CORP14 citations84
US7804118B2Sep 28, 2010

Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same

RENESAS TECH CORP5 citations74
US7683419B2Mar 23, 2010

Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same

RENESAS TECH CORP7 citations74
US6740901B2May 25, 2004

Production of semiconductor integrated circuit

RENESAS TECH CORP8 citations74
US7511327B2Mar 31, 2009

Capacitive electrode having semiconductor layers with an interface of separated grain boundaries

RENESAS TECH CORP3 citations63
US6989304B1Jan 24, 2006

Method for manufacturing a ruthenium film for a semiconductor device

RENESAS TECH CORP3 citations63
US6955959B2Oct 18, 2005

Method of making a memory structure having a multilayered contact and a storage capacitor with a composite dielectric layer of crystalized niobium pentoxide and tantalum pentoxide films

RENESAS TECH CORP3 citations63
US7265407B2Sep 4, 2007

Capacitive electrode having semiconductor layers with an interface of separated grain boundaries

RENESAS TECH CORP0 citations52
US7119407B2Oct 10, 2006

Semiconductor device and manufacturing method thereof

RENESAS TECH CORP0 citations50

AKIYAMA SATORU

1 patent

RENESAS TECHONOLOGY CORP

1 patent

RENESAS ELECTRONICS CORP

1 patent