Inventor
MATSUI YUICHI
JP39 patents
⚠️ This page may combine multiple inventors who share the name “MATSUI YUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
12 patentsUS6743739B2Jun 1, 2004
Fabrication method for semiconductor integrated devices
RENESAS TECH CORP47 citations96
US7667218B2Feb 23, 2010
Semiconductor integrated circuit device and method of manufacturing the same
RENESAS TECH CORP19 citations93
US7408218B2Aug 5, 2008
Semiconductor device having plural dram memory cells and a logic circuit
RENESAS TECH CORP30 citations93
US6833577B2Dec 21, 2004
Semiconductor device
RENESAS TECH CORP16 citations92
US7638786B2Dec 29, 2009
Semiconductor and semiconductor manufacturing arrangements having a chalcogenide layer formed of columnar crystal grains perpendicular to a main substrate surface
RENESAS TECH CORP12 citations84
US6992022B2Jan 31, 2006
Fabrication method for semiconductor integrated devices
RENESAS TECH CORP14 citations84
US7804118B2Sep 28, 2010
Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
RENESAS TECH CORP5 citations74
US7683419B2Mar 23, 2010
Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same
RENESAS TECH CORP7 citations74
US7511327B2Mar 31, 2009
Capacitive electrode having semiconductor layers with an interface of separated grain boundaries
RENESAS TECH CORP3 citations63
US6989304B1Jan 24, 2006
Method for manufacturing a ruthenium film for a semiconductor device
RENESAS TECH CORP3 citations63
US6955959B2Oct 18, 2005
Method of making a memory structure having a multilayered contact and a storage capacitor with a composite dielectric layer of crystalized niobium pentoxide and tantalum pentoxide films
RENESAS TECH CORP3 citations63
US7265407B2Sep 4, 2007
Capacitive electrode having semiconductor layers with an interface of separated grain boundaries
RENESAS TECH CORP0 citations52
HITACHI LTD
12 patentsUS6451665B1Sep 17, 2002
Method of manufacturing a semiconductor integrated circuit
HITACHI LTD66 citations96
US6326218B1Dec 4, 2001
Semiconductor integrated circuit and its manufacturing method
HITACHI LTD46 citations96
US6555429B2Apr 29, 2003
Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device
HITACHI LTD19 citations92
US6503791B2Jan 7, 2003
Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device
HITACHI LTD21 citations92
US7728376B2Jun 1, 2010
Semiconductor memory device
HITACHI LTD15 citations84
US6534375B2Mar 18, 2003
Method of forming a capacitor in a semiconductor integrated circuit device using a metal silicon nitride layer to protect an underlying metal silicide layer from oxidation during subsequent processing steps
HITACHI LTD14 citations83
US7112819B2Sep 26, 2006
Semiconductor device and manufacturing method thereof
HITACHI LTD10 citations74
US6521494B2Feb 18, 2003
Method of manufacturing semiconductor devices utilizing underlayer-dependency of deposition of capacitor electrode film, and semiconductor device
HITACHI LTD7 citations74
US6483143B2Nov 19, 2002
Semiconductor device having a capacitor structure including a self-alignment deposition preventing film
HITACHI LTD11 citations74
US6720603B2Apr 13, 2004
Capacitor structure and a semiconductor device with a first metal layer, a second metal silicide layer formed over the first metal layer and a second metal layer formed over the second metal silicide layer
HITACHI LTD11 citations73
US6664157B2Dec 16, 2003
Semiconductor integrated circuit device and the method of producing the same
HITACHI LTD7 citations73
US7364965B2Apr 29, 2008
Semiconductor device and method of fabrication
HITACHI LTD4 citations62
KOBE STEEL LTD
3 patentsUS5086014AFeb 4, 1992
Schottky diode manufacturing process employing the synthesis of a polycrystalline diamond thin film
KOBE STEEL LTD69 citations95
US5107315AApr 21, 1992
Mis type diamond field-effect transistor with a diamond insulator undercoat
KOBE STEEL LTD41 citations92
US5373172ADec 13, 1994
Semiconducting diamond light-emitting element
KOBE STEEL LTD3 citations62
RENESAS ELECTRONICS CORP
3 patentsUS8000126B2Aug 16, 2011
Semiconductor device with recording layer containing indium, germanium, antimony and tellurium
RENESAS ELECTRONICS CORP12 citations84
US8044489B2Oct 25, 2011
Semiconductor device with fluorine-containing interlayer dielectric film to prevent chalcogenide material layer from exfoliating from the interlayer dielectric film and process for producing the same
RENESAS ELECTRONICS CORP5 citations63
US7800153B2Sep 21, 2010
Capacitive electrode having semiconductor layers with an interface of separated grain boundaries
RENESAS ELECTRONICS CORP0 citations52