Inventor

DOW WEI-PING

TW5 patents

⚠️ This page may combine multiple inventors who share the name “DOW WEI-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIV NAT CHUNG HSING

4 patents

US11008665B2May 18, 2021

Method for manufacturing copper foil with rough surface in plating tank and its product

UNIV NAT CHUNG HSING0 citations55

US11252816B2Feb 15, 2022

Composite with hollow nano-structures and application thereof

UNIV NAT CHUNG HSING0 citations52

US10465056B2Nov 5, 2019

Method for producing flexible conductive substrate with high transmittance and product thereof

UNIV NAT CHUNG HSING0 citations44

US10543510B2Jan 28, 2020

Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO

UNIV NAT CHUNG HSING0 citations31

NAT UNIV CHUNG HSING

1 patent

US9105696B1Aug 11, 2015

Method of coating surface of substrate hole with layer of reduced graphene oxide

NAT UNIV CHUNG HSING28 citations90