Inventor
HOTTA TERUYUKI
JP34 patents
⚠️ This page may combine multiple inventors who share the name “HOTTA TERUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
17 patentsUS6427480B1Aug 6, 2002
Refrigerant cycle system
DENSO CORP24 citations92
US6053417AApr 25, 2000
Expansion valve integrated with electromagnetic valve
DENSO CORP24 citations92
US6012300AJan 11, 2000
Pressure control valve for refrigerating system
DENSO CORP22 citations92
US5943871AAug 31, 1999
Thermal expansion valve
DENSO CORP25 citations92
US6981390B2Jan 3, 2006
Refrigerant cycle system
DENSO CORP15 citations84
US6935126B2Aug 30, 2005
Refrigeration cycle system
DENSO CORP12 citations84
US6935128B2Aug 30, 2005
Vapor-compression-type refrigerating machine
DENSO CORP10 citations74
US6698236B2Mar 2, 2004
Refrigerant cycle system and condenser
DENSO CORP10 citations73
US6397616B2Jun 4, 2002
Pressure reducer and refrigerating cycle unit using the same
DENSO CORP7 citations73
US10981475B2Apr 20, 2021
Seat air-conditioning system
DENSO CORP6 citations72
US9683761B2Jun 20, 2017
Integration valve and heat pump cycle
DENSO CORP5 citations72
US9636622B2May 2, 2017
Accumulator
DENSO CORP3 citations72
US9726407B2Aug 8, 2017
Expansion valve for a refrigeration cycle
DENSO CORP3 citations70
US10500925B2Dec 10, 2019
Refrigeration cycle device
DENSO CORP2 citations68
US11480197B2Oct 25, 2022
Ejector module
DENSO CORP0 citations50
US11460049B2Oct 4, 2022
Ejector
DENSO CORP0 citations50
US9109823B2Aug 18, 2015
Integration valve
DENSO CORP0 citations40
UEMURA KOGYO KK
4 patentsUS5266103ANov 30, 1993
Bath and method for the electroless plating of tin and tin-lead alloy
UEMURA KOGYO KK25 citations92
US5294554AMar 15, 1994
Analysis of tin, lead or tin-lead alloy plating solution
UEMURA KOGYO KK10 citations73
US5234572AAug 10, 1993
Metal ion replenishment to plating bath
UEMURA KOGYO KK9 citations73
US11001936B2May 11, 2021
Surface treating device
UEMURA KOGYO KK0 citations46
HOTTA TERUYUKI
3 patentsUS8197583B2Jun 12, 2012
Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
HOTTA TERUYUKI4 citations60
US8276270B2Oct 2, 2012
Method for manufacturing printed circuit board
HOTTA TERUYUKI4 citations56
US8137447B2Mar 20, 2012
Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
HOTTA TERUYUKI0 citations50