Inventor
BEROZ MASUD
US77 patents
⚠️ This page may combine multiple inventors who share the name “BEROZ MASUD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
42 patentsUS6329605B1Dec 11, 2001
Components with conductive solder mask layers
TESSERA INC180 citations99
US9153562B2Oct 6, 2015
Stacked packaging improvements
TESSERA INC60 citations98
US8927337B2Jan 6, 2015
Stacked packaging improvements
TESSERA INC76 citations98
US7989940B2Aug 2, 2011
System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
TESSERA INC63 citations98
US7462936B2Dec 9, 2008
Formation of circuitry with modification of feature height
TESSERA INC84 citations98
US7453157B2Nov 18, 2008
Microelectronic packages and methods therefor
TESSERA INC101 citations98
US7176506B2Feb 13, 2007
High frequency chip packages with connecting elements
TESSERA INC320 citations98
US6848173B2Feb 1, 2005
Microelectric packages having deformed bonded leads and methods therefor
TESSERA INC82 citations98
US7176043B2Feb 13, 2007
Microelectronic packages and methods therefor
TESSERA INC69 citations97
US7268426B2Sep 11, 2007
High-frequency chip packages
TESSERA INC56 citations96
US7012323B2Mar 14, 2006
Microelectronic assemblies incorporating inductors
TESSERA INC47 citations96
US6940158B2Sep 6, 2005
Assemblies having stacked semiconductor chips and methods of making same
TESSERA INC52 citations96
US6543131B1Apr 8, 2003
Microelectronic joining processes with temporary securement
TESSERA INC49 citations96
US6384475B1May 7, 2002
Lead formation using grids
TESSERA INC51 citations96
US6361959B1Mar 26, 2002
Microelectronic unit forming methods and materials
TESSERA INC65 citations96
US6188028B1Feb 13, 2001
Multilayer structure with interlocking protrusions
TESSERA INC69 citations96
US6338982B1Jan 15, 2002
Enhancements in framed sheet processing
TESSERA INC38 citations95
US6217972B1Apr 17, 2001
Enhancements in framed sheet processing
TESSERA INC80 citations95
US7793414B2Sep 14, 2010
Methods for forming connection structures for microelectronic devices
TESSERA INC18 citations93
US6541852B2Apr 1, 2003
Framed sheets
TESSERA INC32 citations93
US6461892B2Oct 8, 2002
Methods of making a connection component using a removable layer
TESSERA INC46 citations93
US6261863B1Jul 17, 2001
Components with releasable leads and methods of making releasable leads
TESSERA INC28 citations93
US6228685B1May 8, 2001
Framed sheet processing
TESSERA INC48 citations93
US6214640B1Apr 10, 2001
Method of manufacturing a plurality of semiconductor packages
TESSERA INC119 citations93
US7745943B2Jun 29, 2010
Microelectonic packages and methods therefor
TESSERA INC32 citations92
US7152311B2Dec 26, 2006
Enhancements in framed sheet processing
TESSERA INC25 citations92
US6737265B2May 18, 2004
Microelectronic unit forming methods and materials
TESSERA INC29 citations92
US6063648AMay 16, 2000
Lead formation usings grids
TESSERA INC44 citations92
US6651321B2Nov 25, 2003
Microelectronic joining processes
TESSERA INC27 citations91
US6873039B2Mar 29, 2005
Methods of making microelectronic packages including electrically and/or thermally conductive element
TESSERA INC29 citations89
US7554206B2Jun 30, 2009
Microelectronic packages and methods therefor
TESSERA INC9 citations84
US7427423B2Sep 23, 2008
Components with conductive solder mask layers
TESSERA INC15 citations84
US7288433B2Oct 30, 2007
Method of making assemblies having stacked semiconductor chips
TESSERA INC11 citations84
US7262368B2Aug 28, 2007
Connection structures for microelectronic devices and methods for forming such structures
TESSERA INC10 citations84
US6959489B2Nov 1, 2005
Methods of making microelectronic packages
TESSERA INC12 citations84
US7351641B2Apr 1, 2008
Structure and method of forming capped chips
TESSERA INC11 citations83
US7816251B2Oct 19, 2010
Formation of circuitry with modification of feature height
TESSERA INC6 citations74
US6972473B2Dec 6, 2005
Structure and method of making an enhanced surface area capacitor
TESSERA INC9 citations74
US6867065B2Mar 15, 2005
Method of making a microelectronic assembly
TESSERA INC10 citations74
US6541845B2Apr 1, 2003
Components with releasable leads and methods of making releasable leads
TESSERA INC5 citations74
US6215191B1Apr 10, 2001
Compliant lead structures for microelectronic devices
TESSERA INC14 citations74
US5966592AOct 12, 1999
Structure and method for making a compliant lead for a microelectronic device
TESSERA INC8 citations74
HABA BELGACEM
3 patentsUS8525314B2Sep 3, 2013
Stacked packaging improvements
HABA BELGACEM98 citations99
US8207604B2Jun 26, 2012
Microelectronic package comprising offset conductive posts on compliant layer
HABA BELGACEM93 citations98
US8329581B2Dec 11, 2012
Microelectronic packages and methods therefor
HABA BELGACEM45 citations97
WANG LIANG
2 patentsMOHAMMED ILYAS
1 patentBEROZ MASUD
1 patentINVENSAS CORP
1 patentShowing the top 50 of 77 patents by PatentIndex Score.